From October 23 to 25, the 25th Taiwan Printed Circuit Board International Exhibition lit up the Taipei Nangang Exhibition Center, drawing industry elites and renowned enterprises from around the globe.

CEE, led by Chairman Yang Lin, stole the spotlight with its cutting-edge products and technologies, earning widespread acclaim from industry peers.

CEE showcased an impressive range of products, including rigid multilayer circuit boards (MLBs), high-density interconnect printed circuit boards (HDIs), flexible circuit boards and assemblies (FPCs & FPCAs), as well as rigid-flex boards (R-F). The exceptional performance and craftsmanship of these offerings captivated attendees and received glowing feedback.

The featured products targeted a diverse array of applications, spanning consumer electronics, network communications, automotive electronics, advanced displays, security, industrial controls, and healthcare. They also extended into emerging sectors such as artificial intelligence, big data, cloud computing, IoT, biometrics, wearables, smart homes, and drones. With outstanding performance and stability meeting global high standards, CEE continues to set the benchmark for the industry.

Over the past year, CEE has garnered numerous accolades, including Outstanding Supplier, Annual Strategic Partner, Best Delivery Support, and Best Quality Awards. These honors reflect the company’s professional expertise and leadership in the PCB sector.

Looking ahead, CEE remains committed to a spirit of reform, innovation, and efficiency. The company is determined to develop even higher-quality products and technological solutions, delivering exceptional value to its customers and contributing significantly to the advancement of the industry.