| HLC | HDI | FPC |
|
Max. Layer Count |
2024 |
2025 |
2026 |
||
|
Sample |
Mass Production |
||||
|
Max. Layer Count |
30 |
28 |
42 |
50 |
|
|
Max. Board Size（mm） |
670x580 |
620x580 |
860x600 |
1100x580 |
|
|
Overall Board Thickness（mm） |
0.3-5.0 |
0.4-4.0 |
0.3-8 |
0.3-10 |
|
|
Maxed Cu Thickness |
Inner Layer |
HOZ-6OZ |
HOZ-4OZ |
HOZ-6OZ |
HOZ-6OZ |
|
Outer Layer |
1/3OZ-6OZ |
1/3OZ-4OZ |
1/3OZ-12OZ |
1/3OZ-12OZ |
|
|
Min. Trace Width/Space（mm） |
Inner Layer |
0.050/0.050 |
0.065/0.065 |
0.050/0.050 |
0.050/0.050 |
|
Outer Layer |
0.065/0.065 |
0.075/0.075 |
0.065/0.065 |
0.065/0.065 |
|
|
Min. Via Hole Diameter |
0.15 |
0.15 |
0.1 |
0.1 |
|
|
Max. Aspectratio |
0.834027778 |
0.667361111 |
1.042361111 |
1.250694444 |
|
|
Min. S/M Registration（mm） |
±0.020 |
±0.030 |
±0.015 |
±0.015 |
|
|
Min. S/M Web（mm） |
0.05 |
0.065 |
0.05 |
0.05 |
|
|
Layerto Layer Registration（mm） |
±0.114 |
±0.125 |
±0.100 |
±0.100 |
|
|
Min. Back-drilled Stublength（mm） |
0.05-0.20 |
0.05-0.25 |
0.05-0.20 |
0.05-0.18 |
|
|
Impedance Tolerance |
±8% |
±10% |
±7% |
±7% |
|
|
Surface Finish |
HASL-LF、OSP、ENIG、ImmersionTin、ImmersionAg、GoldenFinger |
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|
Special Process |
POFV, Depth Control Routing, Depth Control Drilling, Segmented Golden finger, Hybrid Pressing |
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