The future of U.S.-China collaboration in the PCB industry lies in innovation, sustainability, and mutual respect. While challenges like IP protection and geopolitical tensions persist, opportunities abound in next-gen materials, flexible PCBs, and eco-friendly processes. By focusing on shared goals and building trust, both nations can lead the electronics industry to new heights.
 

Let’s rise above divisions and embrace balanced partnerships to shape a brighter, more interconnected future. Together, we can prove the power of collaboration in driving global progress.

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