Huizhou CEE PCB Technology Co., Ltd., a subsidiary of CEE PCB (Stock Code: 002579), successfully obtained the ISO 14067:2018 international certification for product carbon footprint. This achievement underscores CEE PCB’s industry-leading position in green manufacturing and sustainable development.


 

What is ISO 14067?

ISO 14067 is a globally recognized standard for carbon footprint accounting, providing quantitative requirements and guidelines for managing carbon emissions throughout a product’s lifecycle. It serves as a critical tool for evaluating green products and services. This certification not only highlights CEE PCB’s commitment to environmental responsibility but also positions its products to align with international standards such as the EU Carbon Border Adjustment Mechanism (CBAM).
 

About CEE PCB

Founded in 2000, CEE PCB specializes in the R&D, production, and sales of:
- Rigid Multilayer PCBs (MLB)
- High-Layer Count PCBs (HLC)
- High-Density Interconnect PCBs (HDI)
- Flexible PCBs & Flexible PCB Assemblies (FPC & FPCA)
- Rigid-Flex PCBs (R-F)

As a key high-tech enterprise under China’s National Torch Program, CEE PCB is also:
- A Vice Chairman Member of the China Printed Circuit Association (CPCA)
- A CPCA industry standard-setting participant
- Holder of 200+ granted intellectual property rights and 500+ patent applications
- A multiple-time recipient of the Guangdong Environmental Excellence Award
 

Commitment to a Sustainable Future

Moving forward, CEE PCB will integrate carbon footprint labeling into its products, reinforcing its commitment to environmental protection and helping customers achieve their ESG goals. Together, we are advancing toward a greener, more sustainable future.