R-F combines the benefits of both rigid and flexible boards. They occupy less space and provide enhanced reliability in signal transmission, aligning with the trend towards slimmer electronic devices.
R-F exhibits resistance to extreme temperatures, both hot and cold, and is flame-resistant. It also ensures stable chemical properties and high reliability.
The design of associated products is advantageous as it can lead to reductions in assembly time and errors, as well as enhance the service life of these products.
Adaptable to spatial constraints due to its ability to change shape. It remains foldable without compromising signal transmission functionality, allowing for a substantial reduction in both the volume and weight of the finished products.
