是重要的电子部件,是电子元器件的支撑体,是电子元器件电气相互连接的载体。具有高密度化,高可靠性,可设计性,可生产性,可组装性和可维护性等优势特点。

Product Characteristics
  • HLC allows for a higher assembly density and resultsin a smaller overall size.
  • Facilitates easier routing of lines, leading to shorter pathsand improved data signal transmission speeds.
  • Primarily utilized in communications, aerospace,and medical sectors.
Product Application