HLC
HLC HDI FPC

 

Max. Layer Count

2024

2025

2026

Sample

Mass Production

Max. Layer Count

30

28

42

50

Max. Board Size(mm)

670x580

620x580

860x600

1100x580

Overall Board Thickness(mm)

0.3-5.0

0.4-4.0

0.3-8

0.3-10

Maxed Cu Thickness

Inner Layer

HOZ-6OZ

HOZ-4OZ

HOZ-6OZ

HOZ-6OZ

Outer Layer

1/3OZ-6OZ

1/3OZ-4OZ

1/3OZ-12OZ

1/3OZ-12OZ

Min. Trace Width/Space(mm)

Inner Layer

0.050/0.050

0.065/0.065

0.050/0.050

0.050/0.050

Outer Layer

0.065/0.065

0.075/0.075

0.065/0.065

0.065/0.065

Min. Via Hole Diameter

0.15

0.15

0.1

0.1

Max. Aspectratio

0.834027778

0.667361111

1.042361111

1.250694444

Min. S/M Registration(mm)

±0.020

±0.030

±0.015

±0.015

Min. S/M Web(mm)

0.05

0.065

0.05

0.05

Layerto Layer Registration(mm)

±0.114

±0.125

±0.100

±0.100

Min. Back-drilled Stublength(mm)

0.05-0.20

0.05-0.25

0.05-0.20

0.05-0.18

Impedance Tolerance

±8%

±10%

±7%

±7%

Surface Finish

HASL-LF、OSP、ENIG、ImmersionTin、ImmersionAg、GoldenFinger

Special Process

POFV,  Depth Control Routing, Depth Control Drilling, Segmented Golden finger, Hybrid Pressing