Items

2024

2025

2026

Sample

Mass Production

Max. Layer Count

8

8

8

10

Number of Flexible Layers

6

4

6

6

HDI Type

2

1

2

2

Drilling (mm)

Min. Mechanical Hole

0.1

0.1

0.075

0.075

Min. Laser Through Hole

0.075

0.075

0.075

0.05

Min. Laser Blind Hole

0.075

0.075

0.075

0.05

Electroplate (um)

Degree of Hole-Filling Depression

≤15

≤15

≤10

≤10

Electroplate Uniformity

0.2

0.2

0.15

0.15

Line: w/s (um)

Total Copper Thickness

＜20um

40/40

40/40

40/40

40/40

Total Copper Thickness

＜25um

45/45

45/45

45/45

45/45

Line: w/s (um）

Total Copper Thickness

＜30um

55/55

55/55

55/55

50/50

Total Copper Thickness

＞30um

65/65

65/65

65/60

65/60

Finger Width ≤0.050 Tolerance (mm)

±0.02

±0.02

±0.015

±0.015

Bonding Gold Finger Pitch Tolerance (mm)

±0.03

±0.03

±0.025

±0.025

Covering Film Aligment Accuracy (mm)

±0.15

±0.15

±0.125

±0.125

Solder Resistance Exposure Accuracy (mm) 

±0.050

±0.050

±0.040

±0.040

Contour Tolerance (within 150mm*150mm)

0.1

0.1

0.08

0.08