HDI
HLC HDI FPC

 

项目

2024

2025

2026

Sample

Mass Production

Max. Layer Count

18L

14L

18L

18L

Stack-Up

1+N+1~6+N+6、Anylayer

Overall Board Thickness (mm)

0.30-2.40

0.35-2.40

0.30-2.40

0.25-2.40

Min. Trace Width/Space (mm)

0.030/0.030(mSAP)

0.040/0.040(Tenting)

0.020/0.020(mSAP)

0.015/0.015(Coreless)

Min Core Thickness (mm)

0.04

0.05

0.04

N/A

Min Prepreg Thickness (mm)

0.03

0.04

0.02

0.02

Min. ViaHole Diameter (mm)

0.1

0.15

0.09

0.09

Min. Micro Via Hole Diameter (mm)

0.065

0.075

0.06

0.06

Max. Aspect Ratio(Through-hole)

10:1

0.334027778

0.417361111

0.417361111

Laser Registrationon TargetPad(mm)

0.135

0.175

0.115

0.115

Max. Aspect Ratio(Microvia)

1:1

0.8:1

0.042361111

0.042361111

Via Filling Dimple(O/I)(mm)

0.015/0.010

0.015/0.010

0.010/0.010

0.010/0.005

S/M Registration(mm)

±0.020

±0.025

±0.015

±0.015

Min. BGA(pitch)(mm)

0.3

0.325

0.275

0.25

Min S/M Opening(mm)

0.1

0.15

0.1

0.08

Impedance Tolerance(InnerLayer)

+/-8%

+/-10%

+/-7%

+/-7%

Surface Finish

OSP,ENIG,OSP+ENIG、ENEPIG、GF